THREE-DIMENSIONAL INTER-CHIP CONTACT THROUGH VERTICAL DISPLACEMENT MEMS

摘要

An electrically conducting, vertically displacing microelectromechanical system (MEMS) is formed on a first integrated circuit chip. The first integrated circuit chip is physically connected to a three-dimensional packaging structure. The three-dimensional packaging structure maintains a fixed distance between the first integrated circuit chip and a second integrated circuit chip. A control circuit is operatively connected to the MEMS. The control circuit directs movement of the MEMS between a first position and a second position. The MEMS makes contact with a contact pad on the second integrated circuit chip when it is in the second position forming a conductive path and providing electrical communication between the first integrated circuit chip and the second integrated circuit chip. The MEMS avoids making contact with the contact pad on the second integrated circuit chip when it is in the first position.

主权项

1. A method comprising:
fabricating a multi-layer chip in a process comprising: selectively forming a first chip; forming a microelectromechanical system (MEMS) device on said first chip,
said MEMS device comprising an electrical conducting, vertical displacement MEMS, anda control circuit operatively connected to said MEMS device; selectively forming a second chip; forming a contact pad on said second chip; and connecting said first chip and said second chip using a three-dimensional packaging structure to maintain a fixed distance between said first chip and said second chip, said contact pad being aligned with said MEMS device.