| 发明名称 |
ALIGNMENT MARK DESIGN FOR PACKAGES |
| 摘要 |
A package includes a device die, a molding material molding the device die therein, a through-via penetrating through the molding material, and an alignment mark penetrating through the molding material. A redistribution line is on a side of the molding material. The redistribution line is electrically coupled to the through-via. |
| 申请公布号 |
US2015348904(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201414465474 |
申请日期 |
2014.08.21 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Huang Li-Hsien;Chen Hsien-Wei;Hsiao Ching-Wen;Yeh Der-Chyang;Jeng Shin-Puu;Yu Chen-Hua |
| 分类号 |
H01L23/522;H01L23/31;H01L21/768;H01L23/544 |
主分类号 |
H01L23/522 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package comprising:
a device die; a molding material molding the device die therein; a through-via penetrating through the molding material; an alignment mark penetrating through the molding material; and a redistribution line on a side of the molding material, wherein the redistribution line is electrically coupled to the through-via. |
| 地址 |
Hsin-Chu TW |
