Method of Manufacturing a Semiconductor Device

摘要

The present invention supplies a manufacturing method of a semiconductor device, which includes a non-contact inspection process capable of confirming if a circuit or circuit element formed on an array substrate is normally performed and can decrease a manufacturing cost by eliminating wastes to keep a defective product forming.;An electromotive force generated by electromagnetic induction is rectified and shaped by using primary coils formed on a check substrate and secondary coils formed on an array substrate, whereby a power source voltage and a driving signal are supplied to circuits or circuit elements on a TFT substrate so as to be driven.

主权项

1. A method of manufacturing a semiconductor device comprising:
providing a circuit and at least one secondary coil, the circuit comprising a plurality of semiconductor elements, wherein the at least one secondary coil is electrically connected to the circuit; inducing a voltage in the at least one secondary coil by applying a magnetic field thereto whereby an electric current flows through at least a part of the circuit; measuring an electric field occurring at least a part of the circuit in order to test operation of the circuit.