| 发明名称 |
ENCAPSULATED COMPONENT COMPRISING A MEMS COMPONENT AND METHOD FOR THE PRODUCTION THEREOF |
| 摘要 |
A component comprising a carrier, a chip component and a MEMS component is proposed, wherein the mechanically sensitive MEMS component is mounted below a half-shell on the carrier. The component is encapsulated with a molding compound in a transfer molding process. |
| 申请公布号 |
US2015344296(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201314759602 |
申请日期 |
2013.10.23 |
| 申请人 |
EPCOS AG |
发明人 |
Pahl Wolfgang |
| 分类号 |
B81B7/00;H04R23/00;B81C1/00 |
主分类号 |
B81B7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A component
wherein a chip component and a MEMS component are arranged on a carrier having internal and external electrical connection areas and are electrically conductively connected to the internal connection areas, wherein the MEMS component is arranged below a half-shell seated on the carrier, wherein the entire component is encapsulated with a molding compound such that at least the top side of the carrier and the side surfaces of the chip component and of the MEMS component are covered by the molding compound and the external connection areas are freely accessible. |
| 地址 |
München DE |
