ORGANIC SILICON COMPOUND, CURABLE SILICONE COMPOSITION, AND SEMICONDUCTOR DEVICE

摘要

The present invention is an organic silicon compound represented by a general formula, a hydrosilylation reaction-curable silicone composition containing the organic silicon compound as adhesion promoter, and a semiconductor device obtained by sealing a semiconductor element using a cured product of the composition. Provided are: a novel organic silicon compound; a curable silicone composition, which contains the organic silicon compound as adhesion promoter, has excellent initial adhesiveness and adhesion durability with respect to a base material such as an organic resin, and forms a cured product with high optical transparency; and a semiconductor device of excellent reliability obtained using said composition.