| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a polished substrate capable of significantly suppressing a plate thickness deviation of the substrate after polishing.SOLUTION: A method for manufacturing a polished substrate includes a process (a) of preparing the substrate as a polishing object having a first and second surfaces, and a process (b) of polishing the first and second surfaces of the substrate by using a double-sided surface polishing device. Therein, the double-sided surface polishing device includes a metallic first surface plate having a first polishing pad and a metallic second surface plate having a second polishing pad, the first surface plate has a disk shape having a first inner circumferential edge and a first outer circumferential edge, in the process (b), the substrate is revolved while being rotated, when a region in the intermediate of the first inner circumferential edge and the first outer circumferential edge of the first surface plate is set as a first intermediate part, the first intermediate part is adjusted so as to get to a higher temperature than the first inner circumferential edge and the first outer circumferential edge. |
