| 摘要 |
PROBLEM TO BE SOLVED: To provide a semi-flex type rigid flex multilayer printed wiring board capable of improving an insulation reliability even in the case where a flexible part is formed from a hard insulation resin layer.SOLUTION: In the rigid flex multilayer printed wiring board, cutting processing is performed from one face to another face of a multilayer rigid substrate formed by alternately laminating the insulation resin layers and a wiring patterns, and a portion that is made into a thin layer by the cutting processing is utilized as a bendable flexible part. At least on an outer layer of the other face in the multilayer rigid substrate, a folding reinforced layer which is resistive against a load of tension is laminated via an insulation adhesive layer and the wiring pattern to be formed in the flexible part is formed on an insulation resin layer positioned between an insulation adhesive layer that is positioned in the flexible part, and a cutting-processed bottom face of the insulation resin layer that is cut by the cutting processing. |
