Air Gap Creation In Electronic Devices

摘要

A method for creating an air gap in an electronic device, for example, a passive electronic component chip (PECC) for high frequency microwave transmission is provided. Electronic circuitry of a passive electronic component, for example, a termination, an attenuator, etc., is fabricated in a predetermined configuration on a single layer of a substrate to create the PECC. An air gap of configurable dimensions is created at a configurable location on the substrate by dicing the substrate at the configurable location to create a suspended substrate-like environment in the PECC. The created air gap reduces the dielectric constant at the configurable location and reduces capacitance of the substrate along areas located directly above the air gap. The created air gap also reduces a loss tangent, high frequency attenuation, and electromagnetic fields near a ground plane of the PECC, creates a wide strip dimension, and creates less stringent tolerance in the PECC.

主权项

1. A method for creating an air gap in a passive electronic component chip configured for high frequency microwave transmission, said method comprising:
providing a single layer of a substrate configured to house electronic circuitry of a passive electronic component; fabricating said electronic circuitry of said passive electronic component on said single layer of said substrate to create said passive electronic component chip; determining a plurality of configurable locations on said single layer of said substrate for creating said air gap; and creating said air gap of configurable dimensions at one of said determined configurable locations on said single layer of said substrate by dicing said single layer of said substrate at said one of said determined configurable locations, wherein said air gap is configured to create a suspended substrate-like environment in said passive electronic component chip, and wherein said air gap is further configured to attain a reduced dielectric constant at said one of said determined configurable locations for said high frequency microwave transmission, reduce capacitance of said substrate along areas located directly above said air gap, reduce a loss tangent, reduce high frequency attenuation, reduce electromagnetic fields near a ground plane of said passive electronic component chip, create a wide strip dimension, and create less stringent tolerance in said passive electronic component chip.