| 发明名称 |
PROCESS FOR PREPARING A SEMICONDUCTOR STRUCTURE FOR MOUNTING |
| 摘要 |
A process for preparing a semiconductor structure for mounting to a carrier is disclosed. The process involves causing a support material to substantially fill a void defined by surfaces formed in the semiconductor structure and causing the support material to solidify sufficiently to support the semiconductor structure when mounted to the carrier. |
| 申请公布号 |
US2015349217(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201514826473 |
申请日期 |
2015.08.14 |
| 申请人 |
KONINKLIJKE PHILIPS N.V. |
发明人 |
SUN DECAI;SUN CHARLENE;SHCHEKIN OLEG |
| 分类号 |
H01L33/54;H01L33/48;H01L33/62 |
主分类号 |
H01L33/54 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A process for preparing a semiconductor structure for mounting to a carrier, the process comprising:
causing a support material to substantially fill a void defined by surfaces formed in the semiconductor structure; causing the support material to solidify sufficiently to support the semiconductor structure when mounted to the carrier. |
| 地址 |
Eindhoven NL |
