发明名称 HEATER/SENSOR SUB-ASSEMBLY AND SOLDER CARTRIDGE
摘要 The present invention pertains to a structure for a heater/sensor sub-assembly for a soldering cartridge and solder suction cartridge of a soldering system. This structure provides high heat capacity and accurate soldering-iron-tip-temperature detection and control functions. A coil part of a heater assembly is set apart from a distal end part of the sub-assembly toward the base end side in order to place a distance between a thermocouple temperature sensor and a coil. The solder cartridge includes connector wires linking a coil wire of a heater to a connecting part between a handle and a soldering station, the connector wires varying in size and material in order to reduce the conduction of heat to the handle.
申请公布号 WO2015182487(A1) 申请公布日期 2015.12.03
申请号 WO2015JP64660 申请日期 2015.05.21
申请人 HAKKO CORPORATION 发明人 MOCHIZUKI, TOSHIKAZU;MATSUZAKI, KENJI;TAKEUCHI, HITOSHI
分类号 B23K3/02;B23K3/03;G01K7/02;H05B3/00 主分类号 B23K3/02
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