发明名称 SYSTEM AND METHOD FOR ADJUSTING PERFORMANCE BASED ON THERMAL CONDITIONS WITHIN A PROCESSOR
摘要 A system and method for efficient management of operating modes within an integrated circuit (IC) for optimal power and performance targets. A semiconductor chip includes processing units each of which operates with respective operating parameters. Temperature sensors are included to measure a temperature of the one or more processing units during operation. A power manager determines a calculated power value independent of thermal conditions and current draw. The power manager reads each of a first thermal design power (TDP) value for the processing units and a second TDP value for a platform housing the semiconductor chip. The power manager determines a ratio of the first TDP value to the second TDP value. Additionally, the power manager determines another ratio of the first TDP value to the calculated power value. Using the measured temperature, the ratios and the calculated power value, the power manager determines a manner to adjust the operating parameters.
申请公布号 US2015346798(A1) 申请公布日期 2015.12.03
申请号 US201414293520 申请日期 2014.06.02
申请人 Advanced Micro Devices, Inc. ;ATI Technologies ULC 发明人 Dongara Praveen K.;Dasgupta Aniruddha;Clark Adam
分类号 G06F1/32;G06F1/20 主分类号 G06F1/32
代理机构 代理人
主权项 1. A semiconductor chip comprising: one or more processing units, each operating with respective operating parameters; a power manager configured to: read each of a first thermal design power (TDP) value for the one or more processing units and a second TDP value for a platform housing the semiconductor chip;determine a first ratio of the first TDP value to the second TDP value; anddetermine a temperature headroom based on at least the first ratio.
地址 Sunnyvale CA US