发明名称 |
POLISHING APPARATUS |
摘要 |
A polishing apparatus includes: a polishing table 12 for holding a polishing pad; a first electric motor 14 that rotationally drives the polishing table 12; a first rotary joint 40 that has a rotating body 41 that is rotationally driven by the first electric motor 14, a housing 42 provided around the rotating body 41, and a seal portion 44 that seals between the rotating body 41 and the housing 42; a second current sensor 31 that detects a current which is correlated with driving load of the first electric motor 14; a friction detecting unit 50 that detects sliding friction in the seal portion 44 of the first rotary joint 40; and an end point detecting apparatus 60 that detects a polishing end point of the polishing target on the basis of the current and the sliding friction. |
申请公布号 |
US2015343594(A1) |
申请公布日期 |
2015.12.03 |
申请号 |
US201514727234 |
申请日期 |
2015.06.01 |
申请人 |
Ebara Corporation |
发明人 |
SHINOZAKI Hiroyuki |
分类号 |
B24B37/013;B24B49/10;B24B49/16;B24B37/10 |
主分类号 |
B24B37/013 |
代理机构 |
|
代理人 |
|
主权项 |
1. A polishing apparatus comprising:
a polishing table for holding a polishing pad for polishing a polishing target; a first driving unit that rotationally drives the polishing table; a first rotary joint that has a rotating body that is rotationally driven by the first driving unit, a housing provided around the rotating body, and a seal portion that seals between the rotating body and the housing; a current detecting unit that detects a current which is correlated with driving load of the first driving unit; a friction detecting unit that detects sliding friction in the seal portion of the first rotary joint; and an end point detecting apparatus that detects a polishing end point of the polishing target on the basis of the current detected by the current detecting unit and the sliding friction detected by the friction detecting unit. |
地址 |
Tokyo JP |