发明名称 POLISHING APPARATUS
摘要 A polishing apparatus includes: a polishing table 12 for holding a polishing pad; a first electric motor 14 that rotationally drives the polishing table 12; a first rotary joint 40 that has a rotating body 41 that is rotationally driven by the first electric motor 14, a housing 42 provided around the rotating body 41, and a seal portion 44 that seals between the rotating body 41 and the housing 42; a second current sensor 31 that detects a current which is correlated with driving load of the first electric motor 14; a friction detecting unit 50 that detects sliding friction in the seal portion 44 of the first rotary joint 40; and an end point detecting apparatus 60 that detects a polishing end point of the polishing target on the basis of the current and the sliding friction.
申请公布号 US2015343594(A1) 申请公布日期 2015.12.03
申请号 US201514727234 申请日期 2015.06.01
申请人 Ebara Corporation 发明人 SHINOZAKI Hiroyuki
分类号 B24B37/013;B24B49/10;B24B49/16;B24B37/10 主分类号 B24B37/013
代理机构 代理人
主权项 1. A polishing apparatus comprising: a polishing table for holding a polishing pad for polishing a polishing target; a first driving unit that rotationally drives the polishing table; a first rotary joint that has a rotating body that is rotationally driven by the first driving unit, a housing provided around the rotating body, and a seal portion that seals between the rotating body and the housing; a current detecting unit that detects a current which is correlated with driving load of the first driving unit; a friction detecting unit that detects sliding friction in the seal portion of the first rotary joint; and an end point detecting apparatus that detects a polishing end point of the polishing target on the basis of the current detected by the current detecting unit and the sliding friction detected by the friction detecting unit.
地址 Tokyo JP