发明名称 LASER MACHINING DEVICE AND LASER MACHINING METHOD
摘要 A laser processing apparatus 1 is an apparatus for forming a modified region R in an object to be processed S by irradiating the object S with laser light L. The laser processing apparatus 1 comprises a laser light source 2 that emits the laser light L, a mount table 8 that supports the object S, and an optical system 11 that converges a ring part surrounding a center part including an optical axis of the laser light L in the laser light L emitted from the laser light source 2 at a predetermined part of the object S supported by the mount table 8. The optical system 11 adjusts a form of at least one of inner and outer edges of the ring part of the laser light L according to a position of the predetermined part in the object S.
申请公布号 US2015343562(A1) 申请公布日期 2015.12.03
申请号 US201314763267 申请日期 2013.11.29
申请人 HAMAMATSU PHOTONICS K.K. 发明人 HIROSE Tsubasa;TAKIGUCHI Yuu;IGASAKI Yasunori;SHIMOI Hideki
分类号 B23K26/06;H01L21/67;H01L21/268;B23K26/00 主分类号 B23K26/06
代理机构 代理人
主权项 1. A laser processing apparatus for forming a modified region in an object to be processed by irradiating the object with laser light, the apparatus comprising: a laser light source that emits the laser light; a support unit that supports the object; and an optical system that converges a ring part surrounding a center part including an optical axis of the laser light in the laser light emitted from the laser light source at a predetermined part of the object supported by the support unit; wherein the optical system adjusts a form of at least one of inner and outer edges of the ring part according to a position of the predetermined part in the object.
地址 Hamamatsu-shi, Shizuoka JP