COMPONENT MOUNTING APPARATUS

摘要

A component mounting apparatus (1) mounts a component (D) on a substrate (P) having a hole (47). The component mounting apparatus (1) is provided with: a fixing means (33) that aligns and fixes the substrate (P); a holding means (40) that inserts a lead (41) of the component into the hole (47) by holding the lead-attached component (D) and moving down; a bending member (44) that bends the lead (41) of the component by pressing, to the lead, a sloped surface (49) formed on an upper portion of the bending member, said lead having been inserted into the substrate fixed by means of the fixing means (33); and a lift means (20), which relatively brings up the bending member (44) with respect to the substrate, and which presses the sloped surface (49) to the lead (41) of the component.