MANUFACTURING METHOD OF THICK FILM WIRING STRUCTURE AND THICK FILM WIRING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a thick film wiring structure and a thick film wiring structure that electroless plating is unnecessary, the thick film wiring can be shaped in a short time, unevenness of the film thickness of the thick film wiring is little, and resistivity is low.SOLUTION: A manufacturing method of a thick film wiring structure 1 includes: a porous electrical conduction membrane formation step forming a porous electrical conduction membrane 30 having air gap inside on a surface of a substrate 10; and a compact electrical conduction membrane formation step forming a compact electrical conduction membrane 40 that the porous electrical conduction membrane 30 became compact by electrolytic plating the porous electrical conduction membrane 30.