METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND THERMOSETTING RESIN SHEET

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device, by which a semiconductor device with fewer voids can be manufactured.SOLUTION: A method for manufacturing a semiconductor device comprises the step of hot-pressing a laminate including a chip mounting board and a thermosetting resin sheet disposed on the chip mounting board, thereby filling the thermosetting resin sheet in a gap between the board and a semiconductor chip while covering the semiconductor chip with the thermosetting resin sheet.