| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold device and an apparatus and a method for compression molding which can suppress variation of the mold clamping force.SOLUTION: A mold device is provided with toggle linkages which are arranged under a slide plate and transmit the mold clamping force of the mold clamping mechanism to the slide plate. The toggle linkages have a first link member for moving the slide plate, a second link member having a first end connected turnably to a lower fixed plate and a second end connected turnably to the first link member and a third link member connecting the second link member and the mold clamping mechanism together. Under the slide plate, at least three toggle linkages are arranged. |
