| 发明名称 |
WIRING BOARD |
| 摘要 |
A wiring board in the present invention includes an insulating layer, a via-hole penetrating from an upper surface to a lower surface of the insulating layer, a wiring formation layer, and a grounding or power supply conductor, in which the wiring formation layer is formed of a plurality of strip-shaped conductors, and an insulating resin portion filled in at least between the strip-shaped conductors, the grounding or power supply conductor is formed to partially face the strip-shaped conductors, and a relative permittivity of the insulating layer is higher than a relative permittivity of the insulating resin portion. |
| 申请公布号 |
US2015351227(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201514723604 |
申请日期 |
2015.05.28 |
| 申请人 |
KYOCERA Circuit Solutions, Inc. |
发明人 |
HASEGAWA Yoshihiro |
| 分类号 |
H05K1/02;H05K1/11 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wiring board comprising:
an insulating layer; a via-hole penetrating from an upper surface to a lower surface of the insulating layer to electrically connect the upper surface to the lower surface of the insulating layer; a wiring formation layer formed on a surface of the insulating layer; and a grounding or power supply conductor formed on a surface opposite to the surface of the insulating layer on which the wiring formation layer is formed, wherein the wiring formation layer is formed of a plurality of strip-shaped conductors extending in parallel to each other, and an insulating resin portion filled in at least between the strip-shaped conductors, the grounding or power supply conductor is formed to partially face the strip-shaped conductors, and a relative permittivity of the insulating layer is higher than a relative permittivity of the insulating resin portion. |
| 地址 |
Kyoto JP |
