发明名称 |
ARRAY SUBSTRATE WIRING AND THE MANUFACTURING AND REPAIRING METHOD THEREOF |
摘要 |
This disclosure relates to an array substrate wiring and manufacturing and repairing method thereof. The array substrate wiring comprises a first wiring formed on the substrate for transmitting electric signals; an insulating layer formed on the first wiring; a second wiring formed on the insulating layer, being opposite to the first wiring, the second wiring being in a hanging state and not transmitting electric signals. By means of such a double layer wiring structure, the holes produced in the insulating layer are blocked using the second wiring in the upper layer, such that the outside moisture cannot reach the first wiring via the holes in the insulating layer, thereby protecting the first wiring for transmitting electric signals from corrosion and scratch. |
申请公布号 |
US2015348994(A1) |
申请公布日期 |
2015.12.03 |
申请号 |
US201414469554 |
申请日期 |
2014.08.26 |
申请人 |
BOE TECHNOLOGY GROUP CO., LTD. |
发明人 |
Liu Chao;Zhang Yujun;He Zengsheng;Chen Lei |
分类号 |
H01L27/12 |
主分类号 |
H01L27/12 |
代理机构 |
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代理人 |
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主权项 |
1. An array substrate wiring comprising:
a first wiring formed on an substrate for transmitting electric signals; an insulating layer formed on the first wiring; a second wiring formed on the insulating layer, being opposite to the first wiring, the second wiring being in a hanging state and not transmitting electric signals. |
地址 |
Beijing CN |