| 发明名称 |
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A semiconductor structure includes a substrate including a front side, a conductive bump disposed over the front side, and an opaque molding disposed over the front side and around a periphery portion of an outer surface of the conductive bump, wherein the opaque molding includes a recessed portion disposed above a portion of the front side adjacent to a corner of the substrate and extended through the opaque molding to expose the portion of the front side and an alignment feature disposed within the portion of the front side. |
| 申请公布号 |
US2015348927(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201414287389 |
申请日期 |
2014.05.27 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
发明人 |
KUO HSUAN-TING;TSAI YU-PENG;LIN WEI-HUNG;JAO CHUN-LUNG;SHIH CHAO-WEN;CHENG MING-DA;LIU CHUNG-SHI |
| 分类号 |
H01L23/00;H01L23/29;H01L23/544;H01L23/31;H01L21/78;H01L21/56 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor structure, comprising:
a substrate including a front side; a conductive bump disposed over the front side; and an opaque molding disposed over the front side and exposing a portion of an outer surface of the conductive bump, wherein the opaque molding includes a recessed portion disposed above a portion of the front side adjacent to a corner of the substrate and extended through the opaque molding to expose the portion of the front side and an alignment feature disposed within the portion of the front side. |
| 地址 |
HSINCHU TW |
