| 摘要 |
PROBLEM TO BE SOLVED: To provide a dress sheet that efficiently dresses a cutting blade while cutting an object to be processed, without causing a problem such as pop of a chip and movement of a wafer, and to provide a processing method using the dress sheet.SOLUTION: In a dress sheet 1 stuck to a face of a wafer W, which is cut with a cutting blade, abrasive grains 23 are contained in a resin layer 2 in order to dress the cutting blade, and the dressing of the cutting blade is carried out in parallel with cutting. Additionally, since a dicing tape can be stuck to the rear face side of the wafer W, even if adhesion of the dress sheet 1 decreases due to the content of the abrasive grains 23, such a problem that pop of a chip or movement of the wafer W causes an abnormal shape of the chip can be prevented. Additionally, adhesion of cut waste to the face is prevented by sticking the dress sheet 1 to the face of the wafer W, which is cut with the cutting blade, and therefore, cutting satisfactory in processing quality can be performed. |
