发明名称 MANUFACTURING METHOD OF MEMS STRUCTURE AND MEMS STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of an MEMS structure which reduces the occurrence of sticking, and to provide the MEMS structure.SOLUTION: A manufacturing method of an MEMS structure 1 includes: a preparation step where a substrate 2, on which a fixed electrode 31 and a sacrifice layer 90 disposed on the fixed electrode 31 are arranged, is prepared; a formation step where a movable part 323 forming a part of a movable electrode 32 is formed on the sacrifice layer 90 and support beam parts 71, 72 connected with the movable part 323 are formed on the substrate 2; a removal step where the sacrifice layer 90 is removed; and a cutting step where the movable part 323 and the support beam parts 71, 72 are cut by electric action.
申请公布号 JP2015213963(A) 申请公布日期 2015.12.03
申请号 JP20140096176 申请日期 2014.05.07
申请人 SEIKO EPSON CORP 发明人 INABA SHOGO
分类号 B81C1/00;B81B3/00;G01L9/00;H01L29/84;H03B5/30;H03H3/007;H03H9/24 主分类号 B81C1/00
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