DESMEARING METHOD AND DESMEARING DEVICE

摘要

Provided are a desmearing method and a desmearing device which are able to reliably remove a smear derived from any of an inorganic substance and an organic substance, and eliminate the need to use a chemical that requires a waste liquid treatment. The desmearing method of the present invention is directed to a desmearing method for a wiring substrate material that is a laminated body of insulating layers made from resin containing a filler and a conductive layer, and includes an ultraviolet irradiation treatment step for irradiating the wiring substrate material with ultraviolet beams with a wavelength of 220 nm or less, and a physical vibration treatment step for applying physical vibrations to the wiring substrate material which has undergone the ultraviolet irradiation treatment step.

主权项

1. A desmearing method for a wiring substrate material that includes a laminated body of an insulating layer made from resin containing a filler and a conductive layer, said wiring substrate material having a through hole that penetrates through said insulation layer, said desmearing method comprising:
an ultraviolet irradiation treatment step of irradiating the wiring substrate material with an ultraviolet beam with a wavelength equal to or less than 220 nm; and a physical vibration treatment step of applying physical vibrations to the wiring substrate material which has undergone the ultraviolet irradiation treatment step.