HEAT MAPPING OF DEFECTS IN SOFTWARE PRODUCTS

摘要

Systems, methods, and other embodiments associated with heat mapping of defects in software components are described. In one embodiment, a method includes receiving feedback data that describes errors reported from a software product, wherein the software product includes components. Records are retrieved that are associated with the errors reported, where a record links an error to a defect in a component from the software product. A heat map is generated that has regions assigned to represent different components from the software product. Graphical elements are generated and added to a region for each defect identified in a corresponding component, where a size of a visual area of the region is based, at least in part, on a number of graphical elements contained in the region.

主权项

1. A non-transitory computer storage medium having instructions stored thereon for execution by a device, the non-transitory computer storage medium comprising:
instructions configured to receive feedback data that describes errors reported from a software product, wherein the software product includes components; instructions configured to retrieve records associated with the errors reported, wherein a record links an error to a defect in a component from the software product; and instructions configured to generate a heat map having regions, wherein the regions are assigned to represent different components from the software product, wherein the instructions are configured to generate and add graphical elements to a region for each defect identified in a corresponding component, and wherein the instructions to generate the heat map include instructions to generate a size of a visual area of each of the regions is based, at least in part, on a number of graphical elements contained in the regions, wherein the number of graphical elements in each of the regions corresponds to a number of defects associated with each of the different components from the software product.