| 发明名称 |
Metal Pad for Laser Marking |
| 摘要 |
A package includes a device die, a molding material molding the device die therein, and a plurality of redistribution lines overlying the device die and the molding material. A laser mark pad is coplanar with one of the plurality of redistribution lines, wherein the laser mark pad and the one of the plurality of redistribution layers are formed of the same conductive material. A polymer layer is over the laser mark pad and the plurality of redistribution lines. A tape is attached over the polymer layer. A laser mark penetrates through the tape and the polymer layer. The laser mark extends to a top surface of the laser mark pad. |
| 申请公布号 |
US2015348912(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201414486353 |
申请日期 |
2014.09.15 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
Su An-Jhih;Chen Hsien-Wei |
| 分类号 |
H01L23/544;H01L21/56;H01L21/48;H01L23/495;H01L23/31 |
主分类号 |
H01L23/544 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package comprising:
a first package comprising:
a device die;a molding material molding the device die therein;a plurality of redistribution lines overlying the device die and the molding material;a laser mark pad coplanar with one of the plurality of redistribution lines, wherein the laser mark pad and the one of the plurality of redistribution lines are formed of a same conductive material;a polymer layer over the laser mark pad and the plurality of redistribution lines;a tape over the polymer layer; anda laser mark penetrating through the tape and the polymer layer, wherein the laser mark extends to a top surface of the laser mark pad. |
| 地址 |
Hsin-Chu TW |
