MICROELECTRONIC PACKAGES HAVING SIDEWALL-DEPOSITED HEAT SPREADER STRUCTURES AND METHODS FOR THE FABRICATION THEREOF

摘要

Microelectronic packages and methods for producing microelectronic packages having sidewall-deposited heat spreader structures are provided. In one embodiment, the method includes providing a package body containing a microelectronic device. A heat spreader structure is printed or otherwise formed over at least one sidewall of the package body. The heat spreader structure is thermally coupled to the microelectronic device and is configured to dissipate heat generated thereby during operation of the microelectronic package.

主权项

1. A method for fabricating a microelectronic package, comprising:
providing a package body containing a microelectronic device; and forming a heat spreader structure onto at least one sidewall of the package body, the heat spreader structure thermally coupled to the microelectronic device and configured to dissipate heat generated thereby during operation of the microelectronic package.