| 发明名称 |
PEELING DEVICE, PEELING SYSTEM AND PEELING METHOD |
| 摘要 |
A peeling device which peels a superposed substrate obtained by bonding a first substrate and a second substrate together, from one end portion of the superposed substrate toward the other end portion thereof, includes a first holding unit configured to hold the first substrate of the superposed substrate, a second holding unit configured to hold the second substrate of the superposed substrate, and a moving unit configured to move the first holding unit away from the second holding unit. The moving unit is configured to move in at least a peeling direction of the superposed substrate. |
| 申请公布号 |
US2015343755(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201514723778 |
申请日期 |
2015.05.28 |
| 申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
HONDA Masaru;SAKAMOTO Ryoichi;IKEDA Katsuhiro |
| 分类号 |
B32B43/00 |
主分类号 |
B32B43/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A peeling device which peels a superposed substrate obtained by bonding a first substrate and a second substrate together, from one end portion of the superposed substrate toward the other end portion thereof, comprising:
a first holding unit configured to hold the first substrate of the superposed substrate; a second holding unit configured to hold the second substrate of the superposed substrate; and a moving unit configured to move the first holding unit away from the second holding unit, wherein the moving unit is configured to move in at least a peeling direction of the superposed substrate. |
| 地址 |
Tokyo JP |
