| 摘要 |
This polishing pad is configured so that a plastic deformation area (A) that is calculated using the mathematical formula (1) indicated below is 665 or less when the tensile stress of a polishing layer directly prior to breakage when tensile force acts thereon is defined as the maximum stress (S1) (MPa), the tensile stress that occurs in the polishing layer that has begun to plastically deform is defined as the yield point stress (S2) (MPa), the elongation amount of the polishing layer from when tensile force begins acting thereon until directly prior to breakage thereof is defined as the maximum elongation amount (E1) (mm), and the elongation amount of the polishing layer from when tensile force begins acting thereon until plastic deformation thereof begins is defined as the yield point elongation amount (E2) (mm). A = (S1 - S2) × (E1 - E2)/2 |
