发明名称 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
摘要 Provided are a printed circuit board and a manufacturing method therefor, comprising a lower-clad layer, a groove provided on the lower-clad layer, and an optical fibre for transmitting an optical signal embedded in the groove, wherein the optical fibre comprises micro-optical fibres with a diameter ranging from 500nm to 50um. Since the transmission loss of micro-optical fibres is small, there is no need to perform fluorination on an embedded optical waveguide layer as the prior art, thereby greatly reducing process complexity and reducing the manufacture cost of a printed circuit board.
申请公布号 WO2015180191(A1) 申请公布日期 2015.12.03
申请号 WO2014CN79032 申请日期 2014.05.31
申请人 HUAWEI TECHNOLOGIES CO., LTD. 发明人 WANG, PAN;HAO, QINFEN
分类号 H05K3/00;G03F1/00 主分类号 H05K3/00
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