METHOD OF CLEANING BASE, METHOD OF HEAT TREATMENT OF SEMICONDUCTOR WAFER, AND METHOD OF MANUFACTURING SOLID STATE IMAGE PICKUP DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a technology advantageous for cleaning a base for supporting a processing object in a device for heat treating a semiconductor wafer.SOLUTION: There is provided a method of cleaning a base for supporting a processing object in a device performing heat treatment, where the base includes silicon carbide, and the method includes a first step of preparing a base having an oxide film and a second step of heat treating the base under a gas atmosphere including water vapor after the first step.