发明名称 METHOD FOR MANUFACTURING SOLID-STATE IMAGE SENSING DEVICE
摘要 A method for manufacturing a solid-state image sensing device includes forming a first insulating film on a semiconductor substrate, planarizing the first insulating film, forming a second insulating film after the planarization, forming an opening in the first and the second insulating film, and forming an optical waveguide by forming a filling member in the opening. The thickness of the first insulating film is measured before the formation of the second insulating film, and the second insulating film is formed to a thickness according to the thickness of the first insulating film.
申请公布号 US2015349019(A1) 申请公布日期 2015.12.03
申请号 US201514727516 申请日期 2015.06.01
申请人 CANON KABUSHIKI KAISHA 发明人 Suzuki Sho;Suzuki Kentaro;Okabe Takehito
分类号 H01L27/146 主分类号 H01L27/146
代理机构 代理人
主权项 1. A method for manufacturing a solid-state image sensing device, the method comprising: forming a first insulating film on a semiconductor substrate; planarizing the first insulating film; forming a second insulating film after the planarizing; forming an opening in the first insulating film and the second insulating film; and forming an optical waveguide by forming a filling member in the opening, wherein a thickness of the first insulating film is measured after the planarizing and before the forming of the second insulating film, and the second insulating film is formed to a thickness according to the thickness of the first insulating film.
地址 Tokyo JP