发明名称 |
METHOD FOR MANUFACTURING SOLID-STATE IMAGE SENSING DEVICE |
摘要 |
A method for manufacturing a solid-state image sensing device includes forming a first insulating film on a semiconductor substrate, planarizing the first insulating film, forming a second insulating film after the planarization, forming an opening in the first and the second insulating film, and forming an optical waveguide by forming a filling member in the opening. The thickness of the first insulating film is measured before the formation of the second insulating film, and the second insulating film is formed to a thickness according to the thickness of the first insulating film. |
申请公布号 |
US2015349019(A1) |
申请公布日期 |
2015.12.03 |
申请号 |
US201514727516 |
申请日期 |
2015.06.01 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
Suzuki Sho;Suzuki Kentaro;Okabe Takehito |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
1. A method for manufacturing a solid-state image sensing device, the method comprising:
forming a first insulating film on a semiconductor substrate; planarizing the first insulating film; forming a second insulating film after the planarizing; forming an opening in the first insulating film and the second insulating film; and forming an optical waveguide by forming a filling member in the opening, wherein a thickness of the first insulating film is measured after the planarizing and before the forming of the second insulating film, and the second insulating film is formed to a thickness according to the thickness of the first insulating film. |
地址 |
Tokyo JP |