SOLID-STATE IMAGE PICKUP DEVICE AND IMAGE PICKUP DEVICE

摘要

Provided is a solid-state image pickup device in which a first substrate and a second substrate are laminated and electrically connected by connection units. The first substrate includes: a plurality of pixel units which are disposed in a matrix shape and output signals corresponding to amounts of incident light; and first wiring units which connect the pixel units and the connection units. The second substrate includes: column processing circuits which process the signals generated by the pixel units; and second wiring units which connect the connection units and the column processing circuits. Sum of a wiring resistance of a first wiring unit and a wiring resistance of a second wiring unit are almost identical in each column.

主权项

1. A solid-state image pickup device in which a first substrate and a second substrate are laminated and electrically connected by connection units,
wherein the first substrate comprises:
a plurality of pixel units which are disposed in a matrix shape and output signals corresponding to amounts of incident light; andfirst wiring units which connect the pixel units and the connection units, the second substrate comprises:
column processing circuits which process the signals generated by the pixel units; andsecond wiring units which connect the connection units and the column processing circuits, and wherein sum of a wiring resistance of a first wiring unit and a wiring resistance of a second wiring unit are almost identical in each column.