| 发明名称 |
Vertically Integrated Image Sensor Chips and Methods for Forming the Same |
| 摘要 |
A method includes bonding a Backside Illumination (BSI) image sensor chip to a device chip, forming a first via in the BSI image sensor chip to connect to a first integrated circuit device in the BSI image sensor chip, forming a second via penetrating through the BSI image sensor chip to connect to a second integrated circuit device in the device chip, and forming a metal pad to connect the first via to the second via. |
| 申请公布号 |
US2015349003(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201514825593 |
申请日期 |
2015.08.13 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Lin Jeng-Shyan;Hung Feng-Chi;Yaung Dun-Nian;Liu Jen-Cheng;Chen Szu-Ying;Wang Wen-De;Hsu Tzu-Hsuan |
| 分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
bonding a Backside Illumination (BSI) image sensor chip to a device chip; forming a first via in the BSI image sensor chip to contact a first metal pad in the BSI image sensor chip; forming a second via penetrating through the BSI image sensor chip to contact a second metal pad in the device chip; and forming a third metal pad to electrically connect the first via to the second via. |
| 地址 |
Hsin-Chu TW |
