| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device includes a lead frame, a first semiconductor component, a second semiconductor component, and a first conductive member. The lead frame includes a first segment having a first bottom plate, and a second segment having a second bottom plate. The first segment and the second segment are arranged side by side, the first bottom plate is spatially isolated from the second bottom plate, and the first bottom plate is thicker than the second bottom plate. The first semiconductor component is disposed on the first bottom plate, and the second semiconductor component is disposed on the second bottom plate. The second semiconductor component is thicker than the first semiconductor component. The first conductive member electrically connects the second semiconductor component to the first segment. |
| 申请公布号 |
US2015348889(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201414291563 |
申请日期 |
2014.05.30 |
| 申请人 |
DELTA ELECTRONICS, INC. |
发明人 |
TSAI Hsin-Chang;LEE Chia-Yen;LEE Peng-Hsin |
| 分类号 |
H01L23/495;H01L25/07 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a lead frame comprising:
a first segment comprising a first bottom plate, anda second segment comprising a second bottom plate, wherein the first segment and the second segment are arranged side by side, the first bottom plate is spatially isolated from the second bottom plate, and the first bottom plate is thicker than the second bottom plate; a first semiconductor component disposed on the first bottom plate; a second semiconductor component disposed on the second bottom plate, wherein the second semiconductor component is thicker than the first semiconductor component; and a first conductive member electrically connecting the second semiconductor component to the first segment. |
| 地址 |
Taoyuan Hsien TW |
