Connectable Package Extender for Semiconductor Device Package

摘要

A semiconductor packaging system includes a semiconductor device package having a semiconductor chip with two or more terminals and a protective structure encapsulating and electrically insulating the semiconductor chip. Two or more electrical conductors that are each electrically connected to one of the terminals extend to an outer surface of the protective structure. A first surface feature is on an exterior surface of the semiconductor device package. The system further includes a connectable package extender having a second surface feature configured to interlock with the first surface feature when the first surface feature is mated with the second surface feature so as to secure the package extender to the semiconductor device package. An extension portion adjoins and extends away from the exterior surface of the semiconductor device package when the package extender is secured to the semiconductor device package.

主权项

1. A semiconductor packaging system, comprising:
a semiconductor device package, comprising:
a semiconductor chip comprising two or more terminals;a protective structure encapsulating and electrically insulating the semiconductor chip;two or more electrical conductors extending to an outer surface of the protective structure, each one of the electrical conductors electrically connected to one of the terminals; anda first surface feature on an exterior surface of the semiconductor device package; and a connectable package extender, comprising:
a second surface feature configured to interlock with the first surface feature when the first surface feature is mated with the second surface feature so as to secure the package extender to the semiconductor device package;an extension portion adjoining the second surface feature and extending away from the exterior surface of the semiconductor device package when the package extender is secured to the semiconductor device package.