发明名称 Etching Apparatus and Method
摘要 An etchant is supplied to a workpiece. Furthermore, the workpiece is irradiated with spatially modulated light to adjust a temperature profile of the workpiece while etchant is supplied.
申请公布号 US2015348852(A1) 申请公布日期 2015.12.03
申请号 US201514820344 申请日期 2015.08.06
申请人 Infineon Technologies AG 发明人 Pilch Karl
分类号 H01L21/66;H01L21/306 主分类号 H01L21/66
代理机构 代理人
主权项 1. A method comprising: supplying an etchant to a workpiece to be etched; and irradiating the workpiece with spatially modulated radiation to adjust a temperature profile of the workpiece while the etchant is being supplied to the workpiece.
地址 Neubiberg DE