发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To manufacture a fine transistor with a high yield while suppressing gate insulator film shrinkage and damage.SOLUTION: A semiconductor device comprises: a semiconductor film on an insulating surface; a gate insulator on the semiconductor film; a gate electrode formed on the gate insulator and having a first metal film and a second metal film above the first metal film; and a metal oxide film formed on the gate insulator to be in contact with a side surface of the first metal film and having the same metal element as a metal element in the first metal film. The first metal film has larger ionization tendency than the second metal film.
申请公布号 JP2015216402(A) 申请公布日期 2015.12.03
申请号 JP20150160928 申请日期 2015.08.18
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 NODA KOSEI
分类号 H01L21/336;H01L21/28;H01L21/8242;H01L21/8247;H01L27/108;H01L27/115;H01L29/423;H01L29/49;H01L29/786;H01L29/788;H01L29/792 主分类号 H01L21/336
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