| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device, by which a semiconductor device with fewer voids can be manufactured.SOLUTION: A method for manufacturing a semiconductor device comprises the steps of: pressing a peripheral part of a laminate including a chip mounting board, a thermosetting resin sheet disposed on the chip mounting board, and a film including a center part in contact with the thermosetting resin sheet and a peripheral part disposed around the center part against a stage in contact with the chip mounting board, thereby forming a hermetically sealed container including the stage and the film; and making a pressure outside the hermetically sealed container higher than a pressure in the hermetically sealed container, thereby filling the thermosetting resin sheet in a gap between the board and a semiconductor chip while covering the semiconductor chip with the thermosetting resin sheet. |
