| 发明名称 |
SEMICONDUCTOR PACKAGE HAVING HEAT DISSIPATING MEMBER |
| 摘要 |
A semiconductor package includes a substrate having an upper surface and a lower surface, a semiconductor chip which is mounted on the upper surface of the substrate, and in an upper surface of which a first recess portion is provided, a molding member formed such that the molding member exposes the upper surface of the semiconductor chip and covers the semiconductor chip on the upper surface of the substrate, and a first heat dissipating member formed in the first recess portion, wherein the first heat dissipating member includes moisture absorption particles and a heat dissipation molding member. |
| 申请公布号 |
US2015348863(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201514723834 |
申请日期 |
2015.05.28 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
DU Maohua |
| 分类号 |
H01L23/367;H01L25/065;H01L23/373;H01L23/29;H01L23/00;H01L23/31 |
主分类号 |
H01L23/367 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package comprising:
a substrate having an upper surface and a lower surface; a semiconductor chip mounted on the upper surface of the substrate, the semiconductor chip including an upper surface, and the upper surface including a first recess portion; a molding member that exposes the upper surface of the semiconductor chip and is disposed between the semiconductor chip and the upper surface of the substrate; anda first heat dissipating member formed in the first recess portion, wherein the first heat dissipating member comprises at least one moisture absorption particle and a heat dissipation molding member. |
| 地址 |
Suwon-si KR |
