| 发明名称 |
PRIMER COMPOSITION, METHOD OF FORMING A PRIMER LAYER ON A SEMICONDUCTOR DEVICE, AND METHOD OF ENCAPSULATING A SEMICONDUCTOR DEVICE |
| 摘要 |
A primer composition is provided. The primer composition includes at least one bi- or multi-functional benzoxazine compound; and at least one compound including a functional group having affinity for a metallic surface, and a cross-linkable group. A method of forming a primer layer on a semiconductor device, and a method of encapsulating a semiconductor device are also provided. |
| 申请公布号 |
US2015344730(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201414287231 |
申请日期 |
2014.05.27 |
| 申请人 |
Infineon Technologies AG |
发明人 |
LEE Swee Kah;MAHLER Joachim;TAI Chew Theng;TAN Yik Yee;GOH Soon Lock;LIM Poh Cheng;KRISHNAN Jagen;TEH Peh Hean |
| 分类号 |
C09D179/04;H01L23/29;H01L21/56;C09D163/00;C09D5/08 |
主分类号 |
C09D179/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A primer composition for semiconductor devices, comprising
a) at least one bi- or multi-functional benzoxazine compound; and b) at least one compound comprising (i) a functional group having affinity for a metallic surface, and (ii) a cross-linkable group. |
| 地址 |
Neubiberg DE |
