发明名称 |
CIRCULAR POLISHING PAD |
摘要 |
A circular polishing pad includes a circular polishing layer having XY grid grooves on a polishing surface. The center point of the circular polishing layer is offset in a region (Z) (including imaginary straight lines) enclosed by three imaginary straight lines (A, B, and C) each shifted by a groove pitch of 5% in relation to reference lines defined by an X groove or a Y groove. The circular polishing pad can minimize polishing unevenness on the surface of a material to be polished. |
申请公布号 |
US2015343596(A1) |
申请公布日期 |
2015.12.03 |
申请号 |
US201314654833 |
申请日期 |
2013.12.04 |
申请人 |
TOYO TIRE & RUBBER CO., LTD. |
发明人 |
KIMURA Tsuyoshi |
分类号 |
B24B37/26;B24D11/00;H01L21/67;H01L21/02;H01L21/306 |
主分类号 |
B24B37/26 |
代理机构 |
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代理人 |
|
主权项 |
1. A circular polishing pad including a circular polishing layer having XY grid grooves on a polishing surface, wherein the center point of the circular polishing layer is offset in a region Z (including imaginary straight lines) enclosed by the following three imaginary straight lines A, B and C:
imaginary straight line A: a straight line joining a point on an X groove or a Y groove with a point shifted by a groove pitch of 5% in a direction perpendicular to the X groove or Y groove, imaginary straight line B: a straight line joining a point on one diagonal line D of an XY grid groove with a point shifted by a groove pitch of 5% in a direction perpendicular to the diagonal line D, and imaginary straight line C: a straight line joining a point on the other diagonal line E of the XY grid groove with a point shifted by a groove pitch of 5% in a direction perpendicular to the diagonal line E. |
地址 |
Osaka-shi, Osaka JP |