| 摘要 |
A component (10) such as an interposer or microelectronic element can be fabricated with a set of vertically extending interconnects (32) of wire bond structure. Such method may include forming a structure having wire bonds (32) extending in an axial direction within one of more openings (38) in an element (19) and each wire bond spaced at least partially apart from a wall of the opening within which it extends, the element (19) consisting essentially of a material having a coefficient of thermal expansion ("CTE") of less than 10 parts per million per degree Celsius ("ppm/C"). First contacts (46) can then be provided at a first surface of the component and second contacts (16) provided at a second surface (114) of the component (10) facing in a direction opposite from the first surface (144), the first contacts (46) electrically coupled with the second contacts (16) through the wire bonds (32). |
