| 摘要 |
The present invention relates to a method for manufacturing a circuit board. The present invention is characterized by using a solder bar instead of a solder paste. For the solder bar of the present invention, the size of a cross-sectional area is made constant by about one-nth the size of an opening portion of a metal mask, and the volume of a solder can be adjusted by varying the length. The solder bar according to the present invention can be controlled to be stably inserted into the opening portion of the metal mask one at a time through a capillary device and seated therein. The present invention arranges the metal mask on a circuit board, loads the solder bar into the opening portion of the metal mask by the capillary device after applying flux, and manufactures a solder bump by performing a reflow process. In addition, the metal mask is separated after the reflow process, and a deflux process and a coining process are carried out. |
