| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board in which connection reliability with other electronic component, such as an electronic component, has been enhanced, and to provide a wiring board.SOLUTION: A method of manufacturing a wiring board has a step of forming a wiring layer including a connection terminal on a first insulating layer, a step of forming a second insulating layer on the wiring layer and first insulating layer, a step of patterning the second insulating layer, and forming an insulating dummy part, separated from the wiring layer, on the first insulating layer, a step of forming a third insulating layer on the wiring layer, dummy part, and the first insulating layer, and a step of forming an opening for exposing the connection terminal, in a state where the upper end of the connection terminal is projecting from the third insulating layer, and the lower end side of the connection terminal is embedded in the third insulating layer. |
