发明名称 MOTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To effectively suppress floating of a flexible substrate so as to facilitate soldering during assembly in a device having the flexible substrate soldered to a connection pin and a motor device including the flexible substrate.SOLUTION: A device having a flexible substrate (a motor device 1) comprises: a connection pin 10 protruding from a first flat mounting surface 411a; a flexible substrate 20 having a terminal part 21 placed on the first mounting surface 411a and in which a land 212 soldered to the connection pin 10 is formed; and a substrate holding part 31 which makes a surface contact with at least a part of the terminal part 21 of the flexible substrate 20 and pressing the part against the first mounting surface 411a.
申请公布号 JP2015216844(A) 申请公布日期 2015.12.03
申请号 JP20150174269 申请日期 2015.09.04
申请人 NIDEC SANKYO CORP 发明人 OSHIMA YUUKI;HARA TETSUHIKO;YAZAWA TAKEHIKO
分类号 H02K11/00;H02K3/50 主分类号 H02K11/00
代理机构 代理人
主权项
地址