| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate, a laminate sheet, and a multilayer printed board which achieve reduction of warpage at the time of mounting and enable the formation of fine wiring.SOLUTION: This invention relates to a laminate having a glass substrate layer, a resin composition layer and a circuit board in this order, the circuit board comprising glass cloth and resin. This invention also relates to a laminate sheet, and a multilayer printed board prepared using them. |
