| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of processing an optical device that can increase the light extraction efficiency.SOLUTION: A parting origin groove (M) is formed by irradiating an optical device wafer with a laser beam having a wavelength absorbable by the optical device wafer along a parting scheduled line (ST) on the optical device wafer (W). Thereafter, the side surfaces of the parting origin groove (M) are etched. The optical device wafer is further irradiated with a laser beam having a wavelength permeable through the optical device wafer to form plural reformed layers (R) over the thickness direction of the optical device wafer. The reformed layers which are adjacent in the thickness direction of the optical device wafer are formed to be spaced from each other in the width direction of the parting scheduled line by a predetermined amount. After the reformed layers are formed, the optical device wafer is separated in the width direction of the parting scheduled line, and cracks (K) are formed between the reformed layers adjacent in the thickness direction of the optical device wafer, so that the optical device wafer is divided into individual optical devices (1). |
