TOP PORT MICROELECTROMECHANICAL SYSTEMS MICROPHONE

摘要

A top port microelectromechanical systems (MEMS) microphone is presented herein. A device can include a substrate and a MEMS acoustic sensor mechanically attached to the substrate utilizing anchors. Spaces between the anchors can connect a first back volume corresponding to a bottom portion of the MEMS acoustic sensor with a second back volume to form a combined back volume. An acoustic seal can be placed on the MEMS acoustic sensor, and an enclosure placed on the acoustic seal and secured to the substrate. The acoustic seal can isolate a first portion of the enclosure corresponding to a front volume from a second portion of the enclosure corresponding to the combined back volume. The first portion of the enclosure can include an opening adapted to receive acoustic waves into the front volume, and the front volume can be acoustically coupled to a top portion of the MEMS acoustic sensor.

主权项

1. A device comprising:
a substrate; a micro-electro-mechanical system (MEMS) acoustic sensor mechanically attached to the substrate utilizing a plurality of anchors, wherein spaces between the plurality of anchors connect a first back volume corresponding to a bottom portion of the MEMS acoustic sensor with a second back volume to form a combined back volume; an acoustic seal placed on the MEMS acoustic sensor; and an enclosure placed on the acoustic seal and secured to the substrate, wherein the acoustic seal isolates a first portion of the enclosure corresponding to a front volume from a second portion of the enclosure corresponding to the combined back volume, wherein the first portion of the enclosure comprises an opening adapted to receive acoustic waves into the front volume, and wherein the front volume is acoustically coupled to a top portion of the MEMS acoustic sensor.