| 发明名称 |
METHOD FOR MOLECULAR ADHESION BONDING WITH COMPENSATION FOR RADIAL MISALIGNMENT |
| 摘要 |
A method for bonding a first wafer on a second wafer by molecular adhesion where the wafers have an initial radial misalignment between them. The method includes bringing the two wafers into contact so as to initiate the propagation of a bonding wave between the two wafers while a predefined bonding curvature is imposed on at least one of the two wafers during the contacting step as a function of the initial radial misalignment. |
| 申请公布号 |
US2015348933(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201514820729 |
申请日期 |
2015.08.07 |
| 申请人 |
Soitec |
发明人 |
Gaudin Gweltaz |
| 分类号 |
H01L23/00;B32B41/00;B32B38/18;B32B37/14;B32B37/18 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus for bonding a first wafer on a second wafer by molecular adhesion, the wafers having an initial radial misalignment between them, the apparatus comprising:
a first holding support for holding the first wafer, wherein the first holding support comprises means for imposing a predefined bonding curvature on the first wafer as a function of the initial radial misalignment; a second holding support for holding the second wafer; and means for controlling the apparatus so that the second wafer is released from the second support before or while being brought in contact with the first wafer, so that the second wafer adapts to the bonding curvature imposed on the first wafer during the propagation of a bonding wave. |
| 地址 |
Crolles Cedex FR |
