| 发明名称 |
SEMICONDUCTOR SUBSTRATE, IMAGE PICKUP ELEMENT, AND IMAGE PICKUP APPARATUS |
| 摘要 |
A semiconductor substrate includes: an alignment mark being formed of a material that reflects a detection light for detecting positions and having a detection edge portion; a light-shielding layer portion having a larger outer shape than the alignment mark, being formed of a material that shields the detection light, and being disposed at a position on a backside of the alignment mark when seen from an incidence side of the detection light; and one or more light-transmitting layer portions being laminated between the alignment mark and the light-shielding layer portion so as to transmit the detection light and not being patterned at least in a range that overlaps the light-shielding layer portion. |
| 申请公布号 |
US2015348914(A1) |
申请公布日期 |
2015.12.03 |
| 申请号 |
US201514822197 |
申请日期 |
2015.08.10 |
| 申请人 |
OLYMPUS CORPORATION |
发明人 |
Takazawa Naohiro;Takemoto Yoshiaki |
| 分类号 |
H01L23/544;H01L27/146 |
主分类号 |
H01L23/544 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor substrate comprising:
an alignment mark being formed of a material that reflects a detection light for detecting positions and having a detection edge portion; a light-shielding layer portion haying a larger outer shape than the alignment mark, being formed of a material that shields the detection light, and being disposed at a position on a backside of the alignment mark when seen from an incidence side of the detection light; and one or more light-transmitting layer portions being laminated between the alignment mark and the light-shielding layer portion so as to transmit the detection light and not being patterned at least in a range that overlaps the light-shielding layer portion. |
| 地址 |
Tokyo JP |
